Home > CPU Thermal Pad >

High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

Product Categories

Silicone Thermal Pad [144]
Heat Sink Thermal Pad [166]
CPU Thermal Pad [232]
Thermal Graphite Sheet [28]
Thermally Conductive Electrical Insulator [35]
PCM Phase Change Material [27]
Double Sided Thermal Tape [22]
Heat Conductive Plastic [9]
High Temperature Thermal Grease [15]
Thermally Conductive Potting Compound [9]
Thermal Epoxy Glue [9]
Thermal Conductive Silicone Adhesive [4]
Thermal Conductive Gel [23]
Shielding Absorbing Materials [22]
Silicone Foam Sheet [6]
Silicone Free Thermal Pad [12]
Most Popular Products [11]
Film Heating Element [6]

Dongguan Ziitek Electronical Material and Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

Name: High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element
Brand: Ziitek
Price: 0.1 USD

Buy cheap High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element product

Brand Name : Ziitek

Model Number : TIF100-35-11UF

Certification : RoHS and UL recognized

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

Color : Gray

Thinkness range : 0.02~0.20inch / 0.5~5.0mmT

Sample : Sample Avaliable

Flam rating : 94 V0

Hardness : 75 Shore 00

Thermal Conductivity : 3.5 W/mK

Keywords : Thermal Silicone Pad

Contact Now

High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

TIF100-35-11UF thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Good thermal conductive : 3.5W/mK
> Naturally tacky needing no further adhesive coating

> High compliance adapts to various pressure application environments
> Available in different thickness options

Applications
> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> LED TV and lamps

Typical Properties of TIF^®100-35-11UF Series
Color	Gray	Visual
Construction & Compostion	Ceramic filled silicone elastomer	*******
Density	3.0g/cc	ASTM D297
Thickness range	0.02~0.20inch / 0.5~5.0mmT	ASTM C351
Hardness	75 Shore 00	ASTM 2240
Dielectric Breakdown Voltage	>5500 VAC	ASTM D412
Operating Temp	-40 ~200℃	*******
Dielectric Constant	4.0 MHz	ASTM D150
Volume Resistivity	≥1.0X10¹²Ohm-meter	ASTM D257
Fire rating	94 V0	equivalent UL
Thermal conductivity	3.5W/mK	ASTM D5470

Product Specifications
Standard Thickness:

0.02 to 0.20 (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).

Standard Size:

8"X16"(203 mm×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms.

For other thicknesses or moreinformation. please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Product Tags:

High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronical Material and Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

High Conductive Thermal Silicone Pad

Premium Insulation Thermal Silicone Pad

CPU thermal silicone pad

High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element Images