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2.0W Thermal Insulation Silicone Soft Pad for Heat-Sink GPU Specific Gravity 2.7g/cc Gray Thermal Cooling Laptop Thermal Gap Pad

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Dongguan Ziitek Electronical Material and Technology Ltd.

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2.0W Thermal Insulation Silicone Soft Pad for Heat-Sink GPU Specific Gravity 2.7g/cc Gray Thermal Cooling Laptop Thermal Gap Pad

Name: 20W Thermal Insulation Silicone Soft Pad for HeatSink GPU Specific Gravity 27gcc Gray Thermal Cooling Laptop Thermal Gap Pad
Brand: Ziitek
Price: 0.1 USD

Buy cheap 2.0W Thermal Insulation Silicone Soft Pad for Heat-Sink GPU Specific Gravity 2.7g/cc Gray Thermal Cooling Laptop Thermal Gap Pad product

Brand Name : Ziitek

Model Number : TIF540-20-11U

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : 2.0W Thermal Insulation Silicone Soft Pad Thermal Cooling Laptop Thermal Gap Pad For Heat-Sink GPU

Thickness : 1.0mmT

Specific Gravity : 2.7g/cc

Dielectric Breakdown Voltage : >5500 VAC

Thermal conductivity : 2.0W/m-K

Color : Gray

Operating Temp : -40~200℃

Keywords : Thermal Gap Pad

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2.0W Thermal Insulation Silicone Soft Pad Thermal Cooling Laptop Thermal Gap Pad For Heat-Sink GPU

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Product introduction

TIF500-20-11U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features
> Good thermal conductive: 2.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

Applications
> Cooling components to the chassis of frame
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Mass storage devices
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices

Typical Properties of TIF500-20-11U Series
Property	Value	Test method
Color	Gray	Visual
Construction &Compostion	Ceramic filled silicone elastomer	***
Thickness range	1.0 mmT	ASTM D374
Hardness	27±5 Shore 00	ASTM 2240
Specific Gravity	2.7 g/cc	ASTM D792
Continuos Use Temp	-40 to 200℃	***
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant	4.5 MHz	ASTM D150
Volume Resistivity	1.0X10¹²Ohm-meter	ASTM D257
Fire rating	94 V0	UL E331100
Thermal conductivity	2.0W/m-K	ASTM D5470

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

2.0W Thermal Insulation Silicone Soft Pad for Heat-Sink GPU Specific Gravity 2.7g/cc Gray Thermal Cooling Laptop Thermal Gap Pad

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Product Tags:

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2.0W Thermal Insulation Silicone Soft Pad for Heat-Sink GPU Specific Gravity 2.7g/cc Gray Thermal Cooling Laptop Thermal Gap Pad

2.0W Thermal Insulation Silicone Soft Pad for Heat-Sink GPU Specific Gravity 2.7g/cc Gray Thermal Cooling Laptop Thermal Gap Pad

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2.0W Thermal Insulation Silicone Soft Pad for Heat-Sink GPU Specific Gravity 2.7g/cc Gray Thermal Cooling Laptop Thermal Gap Pad Images