Excellent Long Term Stability 18.9W Thermal Conductivity Metal Phase Changing Materials For Microprocessors Chipsets
TIC®800M is a new type of phase change thermal conductivity product made by mixing multiple metals, designed specifically to solve heat dissipation problems and improve application reliability. This material has high thermal conductivity,is not easy to evaporate,is safe and non-toxic, and has stable physical and chemical properties. When the temperature is higher than its phase transition temperature, the material will soften and undergo phase transition, which can tightly fill the small irregular contact surfaces on the device surface, forming a low contact thermal resistance thermal interface, thereby achieving excellent heat dissipation effect.
Features
> Excellent thermal conductivity
> Non toxic, environmentally friendly, and safe, meeting RoHS requirements
> Excellent long-term stability
> Thoroughly fill the contact surface to create low thermal resistance
> Not easily volatile
Applications
> Microprocessors
> Chipsets
> Graphic processing chips
> Set Top Box
> LED TV and LED lighting fixtures
| Typical Properties of TIC®800M Series |
| Property |
Value |
Test Method |
| Color |
Silvery white |
Visual |
| Form |
Flaky solid |
Visual |
| Construction & Composition |
Bismuth Alloy |
**** |
| Density (g/cm³) |
8.0 |
ASTM D792 |
| Thermal conductivity(W/mK) |
18.9 |
ISO22007 |
| Specific heat capacity(J/g℃) |
0.24 |
ASTM E1269 |
| Resistivity (Ω-m) |
＜10-4 |
ASTM D257 |
| Continuous Use Temp(℃) |
-40 to 250℃ |
***** |
| Phase Change Temperature Range(℃) |
>60 |
ASTM D3418 |
| Solidification Range(℃) |
＜57 |
ASTM D3418 |
Packaing:
TIC®800M can be packaged according to customer requirements.
Usage Instructions:
After using this material, it is recommended to use suitable foam or gaskets to enclose the edges of the phase change metal,
ensuring that the material does not disperse or spread.
For more information about thermal conductive materials, please contact our company.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
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